Ang HRK series na spherical alumina ay ginawa sa pamamagitan ng mataas na temperatura na melting-jet method na nabubuo sa ordinaryong hindi regular na hugis na Al2O3, at pagkatapos ay sumasailalim sa screening, purification at iba pang mga proseso upang makuha ang huling produkto.Ang nakuha na alumina ay may mataas na spheroidization rate, nakokontrol na pamamahagi ng laki ng particle at mataas na kadalisayan.Dahil sa mga natatanging katangian nito tulad ng mataas na thermal conductivity at magandang mobility, Ang produkto ay malawakang ginagamit bilang tagapuno ng mga thermal interface na materyales, thermal engineering plastic at aluminum-based Copper-Clad Laminates at iba pa.
Teknikal na item | Yunit | Code ng produkto ng Serye ng HRK | ||||||||||
Laki ng Particle | HRK-1 | HRK-2 | HRK-5 | HRK-10 | HRK-20 | HRK-30 | HRK-40 | HRK-70 | HRK-90 | HRK-120 | ||
(D10) | µm | 0.71 | 0.69 | 2.54 | 4.55 | 10.5 | 16.88 | 23.77 | 44.32 | 55.23 | 92.39 | |
(D50) | µm | 1.08 | 2.18 | 5.52 | 10.43 | 20.8 | 30.52 | 41.54 | 71.54 | 87.96 | 122.98 | |
(D90) | µm | 3.21 | 5.24 | 9.09 | 20.8 | 37.24 | 48.87 | 66.44 | 106.5 | 134.92 | 172.07 | |
Partikular na Lugar sa Ibabaw | m2/g | 1.69 | 1.27 | 0.36 | 0.17 | 0.14 | 0.13 | 0.12 | 0.12 | 0.1 | 0.06 | |
Electrical Conductivity | u S/cm | 6.07 | 5.4 | 5.65 | 4.05 | 6.87 | 7.95 | 4.65 | 6.18 | 8.15 | 6.45 | |
Halaga ng PH | - | 7.53 | 7.79 | 7.7 | 7.9 | 7.62 | 7.7 | 7.8 | 7.7 | 7.9 | 7.54 | |
Halumigmig | % | 0.05 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 0.04 | |
Tunay na Densidad | g/cm3 | 3.71 | 3.7 | 3.74 | 3.76 | 3.79 | 3.79 | 3.81 | 3.87 | 3.88 | 3.89 | |
Rate ng Spheroidization | % | 96 | 98 | 98 | 98 | 96 | 98 | 96 | 96 | 95 | 95 | |
Komposisyong kemikal | Al2O3 | % | 99.87 | 99.94 | 99.89 | 99.94 | 99.92 | 99.93 | 99.94 | 99.92 | 99.94 | 99.92 |
SiO2 | ppm | 430 | 30 | 430 | 20 | 150 | 20 | 20 | 30 | 20 | 170 | |
Fe2O3 | ppm | 140 | 70 | 140 | 40 | 60 | 60 | 50 | 60 | 60 | 140 | |
Na2O | ppm | 90 | 100 | 10 | 60 | 140 | 90 | 110 | 90 | 70 | 90 |
● Thermal Interface Materials: thermal silica pad, thermal grease, thermally conductive potting glue, phase change materials;
● Thermally Conductive Engineering Plastics: LED lamp cover, switch shell,electronic products shell, electrical products heat dissipation parts;
● Al-based Copper Clad Laminate: high-power LED circuit substrate, power circuit boards, atbp;
● Mga Alumina Ceramic Filter;
Thermal Spray Coating.